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Vapor Phase Reflow and Rework Systems

  • RD52 Inline Vapor Phase Reflow Oven

    Model RD52 Inline System

    • Need it to go faster? Inline vapor phase reflow the way it should be.
    • Left to right product flow
    • 450mm x 380 mm working envelope
    • 4 zone clamshell preheat section
    • SMEMA communications
    • Password protection
    • Unsurpassed reflow profile control
    • Perfect for high volume automated inline vapor phase processing
  • RD1 Vapor Phase Reflow System

    Model RD1 Batch System

    • Big performance in a small package
    • 305mm x 255mm working envelope
    • Convected preheat zone
    • Vapor preheat function
    • Working fluid filtration
    • Working fluid auxiliary storage
    • Process recipe storage
    • All Standard
    • Does everything its big brothers do in a smaller footprint and price range.
  • RD2 Vapor Phase Reflow System

    Model RD2 Batch System

    • Our biggest seller, great for virtually all vapor phase reflow applications
    • 460mm x 380mm working envelope
    • Convected preheat zone
    • Vapor preheat function
    • Working fluid filtration
    • Working fluid auxiliary storage
    • Process recipe storage
    • All Standard
    • Perfect for medium sized product and volume requirements
  • Model RD3 Batch System

    • The biggest baddest vapor phase on the planet
    • 625mm x 625mm working envelope
    • Convected preheat zone
    • Working fluid filtration
    • Dual speed clamshell cooling
    • 10” OIT with password protection and 250 recipes
    • Much more
    • The RD3 was designed around our big board customer’s needs in the field.
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    V-Works 24 Vapor Phase Rework System

    • First and only single component vapor phase rework system in the world
    • Unsurpassed uniformity
    • Global bottom side preheat
    • 50 mm x 550 mm working envelope
    • Vision / Placement
    • Recipe storage
    • Makes the hard rework jobs easy
  • Model RD10 Belted Inline System

    Model RD10 Belted Inline System

    • Great for mechanical attachment
    • High volume continuous production
    • Left to right flow
    • 200 mm belt width
    • Optional sizes available

Vapor Phase Reflow and Rework Systems from R&D VaporTech

Vapor Phase 101

Vapor Phase Reflow, or Condensation Heating, has progressed through many variations since its invention in 1973. It uses an inert liquid chosen for its boiling point, that when heated creates a very stable, uniform, and safe heat transfer medium in the form of vapor. Traditional reflow methods using infrared and convection heat may suffer from various problems that are solved by using a condensation form of heat transfer such as vapor phase.

Vapor Phase utilizes heaters immersed in the vapor phase fluid to boil this fluid and generate vapor. This vapor is seventeen times heavier than air so it remains in the bottom of the vapor tank. Cooling coils then condense any excess vapor returning it to the boiling liquid to maintain a set height of the vapor blanket. The earliest vapor phase systems used only vapor to heat the product from start to finish. Later, preheat was added to better control the heating thermal curve of the product being reflowed. The product was lowered on an elevator system into the preheat or "secondary" vapor which hovered above the primary or "reflow" vapor.

Current designs of most modern vapor phase systems have removed this "secondary" vapor in favor of an IR or Convected Zone type of preheat. This design change took place to provide better control of the preheat thermal curve and allow better solder paste conditioning prior to the reflow stage.

Most system utilize some sort of conveyor system to transport the product though the critical stages of reflow: preheat, reflow, flash off and cooldown.

With lead free initiatives taking place in the semiconductor industry, attention must be paid to the reflow process. Lead based solders such as Sn63/Pb37 melt at 183 C* with a typical reflow temperature of 200 C* - 205 C*. Industry practice has established a safety margin of 30 C* to reduce potential for defects caused by excessive heat. Lead free solderswith a eutectic temperature of 217 C* - 221 C* require a minimum peak  reflow temperature of 230 C*. The same 30 C* safety margin brings the maximum reflow temperature to 260 C*. These higher temperature requirements only amplify the challenges faced by traditional reflow methods, since to ensure reflow across the whole assembly their temperature must be increased much more that the increases in the solder's reflow temperature but vapor phase has none of these problems. Simply choosing a fluid with a higher boiling point will continue to ensure complete reflow while making it impossible to exceed the temperature of its boiling point. Quite simply, lead free solder reflow can be done perfectly by never exceeding 230 C*.

 Advantages to Vapor Phase Reflow and Rework

  • Uniform Temperatures
  • Fast Even Heat Transfer
  • Absolute Limits to Maximim Temperature
  • O2 Free Environment
  • Minimum Liquidus Times
  • Most Repeatable and Uniform Reflow Process
  • Short Setup Times
  • East to Use

 Uses for Vapor Phase Reflow and Rework

  • Solder Reflow
  • BGA Reflow and Rework
  • High Reliability Electronic Packages
  • High Volume Reflow
  • Low Volume High Mix Reflow
  • Large Back Planes and Motherboards
  • Large Mass Differentials
  • Tin Lead Plating Reflow
  • Mechanical Attachment
  • Curing Conductive Inks
  • Plastic Package Testing

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